april 2010 doc id 11554 rev 5 1/9 9 emif03-sim02f3 3-line ipad?, emi filter including esd protection features emi symmetrical (i/o) low-pass filter high efficiency in emi filtering lead-free package very low pcb space consuming: 1.2 mm 2 very thin package: 0.60 mm high efficiency in esd suppression high reliability offered by monolithic integration high reduction of parasitic elements through integration and wafer level packaging complies with the following standards iec 61000-4-2 level 4 on external and v cc pins: ? 15 kv (air discharge) ? 8 kv (contact discharge) iec 61000-4-2 level 1on internal pins: ? 2 kv (air discharge) ? 2 kv (contact discharge) mil std 883e - method 3015-6 class 3 applications emi filtering and esd protection for: sim interface (subscriber identify module) uim interface (universal identify module) description the emif03-sim02f3 is a highly integrated device designed to suppress emi / rfi noise in all systems subjected to electromagnetic interferences. this filter includes an esd protection circuitry which prevents damage to the application when subjected to esd surges up to 15 kv. figure 1. pin configuration (bump side) figure 2. configuration tm : ipad is a trademark of stmicroelectronics. flip chip (8 bumps) b c 1 2 3 a rst in rst ext clk in data in gnd v cc clk ext data ext 47 clk in data in clk ext data ext 100 r1 r2 r3 rst in rst ext 100 v cc gnd cline = 20 pf max. www.st.com
electrical characteristics emif03-sim02f3 2/9 doc id 11554 rev 5 1 electrical characteristics figure 3. electrical characteristics (definitions) table 1. absolute maximum ratings (t amb = 25 c) symbol parameter and test conditions value unit v pp internal pins (a3, b3, c3): esd discharge iec 61000-4-2, air discharge esd discharge iec 61000-4-2, contact discharge external pins (a2, b1, c2, c1): esd discharge iec 61000-4-2, air discharge esd discharge iec 61000-4-2, contact discharge 2 2 15 8 kv t j maximum junction temperature 125 c t op operating temperature range -40 to +85 c t stg storage temperature range -55 to 150 c table 2. electrical characteristics (t amb = 25 c) symbol test conditions min. typ. max. unit v br i r = 1 ma 6 - 20 v i rm v rm = 3 v - - 0.2 a r d -1.5- r 1, r 3 tolerance 20% - 100 - r 2 tolerance 20% - 47 - c line v line = 0 v, v osc = 30 mv, f = 1 mhz - - 20 pf i v i f i rm i r i pp v rm v f v br v cl symbol parameter v = breakdown voltage i = leakage current @ v v = stand-off voltage v = clamping voltage i = peak pulse current i = breakdown current v = forward voltage drop br rm rm rm cl pp r f c = line capacitance = line r series resistance between input and output i/o
emif03-sim02f3 electrical characteristics doc id 11554 rev 5 3/9 figure 4. s21 (db) attenuation measurement (a2-a3 line) figure 5. s21 (db) attenuation measurement (b1-b3 line) db 100.0k 1.0m 10.0m 100.0m 1.0g -40.00 -30.00 -20.00 -10.00 0.00 a2/a3 f (hz) 100.0k 1.0m 10.0m 100.0m 1.0g -40.00 -30.00 -20.00 -10.00 0.00 b1/b3 100.0k 1.0m 10.0m 100.0m 1.0g -40.00 -30.00 -20.00 -10.00 0.00 b1/b3 db f (hz) figure 6. s21 (db) attenuation measurement (c1-c3 line) figure 7. analog crosstalk measurements 100.0k 1.0m 10.0m 100.0m 1.0g -40.00 -30.00 -20.00 -10.00 0.00 c1/c3 100.0k 1.0m 10.0m 100.0m 1.0g -40.00 -30.00 -20.00 -10.00 0.00 c1/c3 db f (hz) 100.0k 1.0m 10.0m 100.0m 1.0g -100.00 -90.00 -80.00 -70.00 -60.00 -50.00 -40.00 -30.00 -20.00 -10.00 0.00 xtalka3/b1 100.0k 1.0m 10.0m 100.0m 1.0g -100.00 -90.00 -80.00 -70.00 -60.00 -50.00 -40.00 -30.00 -20.00 -10.00 0.00 xtalka3/b1 db f (hz) figure 8. digital crosstalk measurements figure 9. line capacitance versus reverse applied voltage (typical) output line 2 2 mv/div input line 1 1 v/div bumps a3 (rst ) and b1 (clk ) in out 10 ns/div v r (v) c(pf) 0 3 6 9 12 15 18 0246
aplac model emif03-sim02f3 4/9 doc id 11554 rev 5 2 aplac model figure 10. aplac model figure 11. aplac parameters model = dint1 model = dint1 model = dext2 model = dext3 c2 lbump rbump 100 47 100 model = dint2 model = dext1 model = dext1 bulk lbump rbump lbump rbump lbump rbump lbump rbump lbump rbump lbump rbump a3 b3 c3 a2 b1 c1 lbump rbump lgnd rgnd cgnd aplacvar ls 950ph aplacvar rs 150m aplacvar cext1 12pf aplacvar cext2 14pf aplacvar cext3 18pf aplacvar cint1 4.5pf aplacvar cint2 4pf aplacvar rbump 17m aplacvar lbump 43ph aplacvar rgnd 500m aplacvar lgnd 50ph aplacvar cgnd 0.15pf aplacvar rsub 100m dint1 bv=15 cjo=cint1 ibv=1u ikf=1000 is=10f isr=100p n=1 m=0.3333 rs=0.29 vj=0.6 tt=50n dext1 bv=15 cjo=cext1 ibv=1u ikf=1000 is=10f isr=100p n=1 m=0.3333 rs=0.25 vj=0.6 tt=50n dint2 bv=15 cjo=cint2 ibv=1u ikf=1000 is=10f isr=100p n=1 m=0.3333 rs=0.31 vj=0.6 tt=50n dext2 bv=15 cjo=cext2 ibv=1u ikf=1000 is=10f isr=100p n=1 m=0.3333 rs=0.28 vj=0.6 tt=50n dext3 bv=15 cjo=cext3 ibv=1u ikf=1000 is=10f isr=100p n=1 m=0.3333 rs=0.25 vj=0.6 tt=50n
emif03-sim02f3 aplac model doc id 11554 rev 5 5/9 figure 12. voltages when iec 61000-4-2 (+15 kv air discharge) applied to external pin figure 13. voltages when iec 61000-4-2 (- 15 kv air discharge) applied to external pin v in : 10 v/div v out : 10 v/div 100 ns/div v in : 10 v/div v out : 10 v/div 100 ns/div
ordering information scheme emif03-sim02f3 6/9 doc id 11554 rev 5 3 ordering information scheme figure 14. ordering information scheme 4 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 15. package dimensions emif yy - xxx zz fx emi filter number of lines information package x = resistance value (ohm) z = capacitance value / 10 (pf) or 3 letters = application 2 digits = version f = flip chip x = 3: lead-free, pitch = 400 m, bump = 255 m 1.14 mm 30 m 1.14 mm 30 m 255 m 40 400 m 40 400 m 40 170 m 10 170 m 10 605 m 55
emif03-sim02f3 ordering information doc id 11554 rev 5 7/9 figure 18. flip chip tape and reel specification 5 ordering information table 3. ordering information note: more information is availa ble in the application notes: an2348: ?stmicroelectronics 400 micro-metre flip chip: package description and recommendation for use? an1751: "emi filters: recommendations and measurements" figure 16. footprint figure 17. marking 220 m recommended 220 m recommended 260 m maximum solder stencil opening : copper pad diameter: solder mask opening: 300 m minimum x y x w z w dot, st logo ecopack status xx = marking yww = datecode (y = year ww = week) z = manufacturing location dot identifying pin a1 location user direction of unreeling all dimensions in mm 4.0 0.1 4.0 0.1 2.0 0.05 8.0 0.3 1.75 0.1 3.5 0.1 ? 1.55 0.1 0.69 0.05 1.24 0.20 0.02 st st st xxz yww xxz yww xxz yww e e e 1.24 st st st xxz yww xxz yww xxz yww e e e order code marking package weight base qty delivery mode emif03-sim02f3 ha flip chip 1.74 mg 5000 tape and reel 7?
revision history emif03-sim02f3 8/9 doc id 11554 rev 5 6 revision history table 4. document revision history date revision changes 19-jul-2005 1 initial release. 26-feb-2007 2 changed out to ext in configuration diagram on page 1. added ecopack statement. reformatted to current layour standard. updated application note an2348 reference and description. 28-nov-2007 3 updated ecopack statement. updated figure 14 , figure 15 , figure 16 and figure 18. reformatted to current standards. 09-feb-2010 4 updated die dimensions in figure 15 and pocket dimensions in figure 18 . 07-apr-2010 5 updated tolerance dimensions in figure 15: package dimensions .
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